The KPS series surface mount Multilayer Ceramic Chip Capacitor utilizes proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors (MLCCs) into a single compact surface mount package. The attached lead-frame mechanically isolates the capacitors from the printed circuit board, therefore offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. A two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Providing up to 10mm of board flex capability.

• Higher capacitance in the same footprint
• Board space savings
• Advanced protection against thermal and mechanical stress
• Provides up to 10mm of board flex capability
• Reduces audible and microphonic noise
• Extremely low ESR and ESL
• Non-polar device, minimizing installation concerns
• Environmentally friendly
• Capable of Pb-Free reflow profiles

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