The Impel Plus Backplane Connector System achieves data rates up to 56 Gbps while delivering optimal signal integrity with grounding tail aligner that minimizes impedance discontinuities and reduces crosstalk. Additionally, an innovative signal interface improves insertion loss over in-line beams, pushing frequencies past 30 GHz.

• Durability (mating cycles max): 200
• Shield Type Full Shield
• Current - Maximum per Contact 0.75A
• 92 Ohms nominal Impendence
• Enables backward and forward compatibility with various high-end architectures
• Offers printed-circuit-board designers the flexibility to quad route the signal traces (two pairs per layer) reducing the PCB layer count
• Molex patent-pending Impel Connector technology with tightly coupled differential-pair structure
• Provides optimal signal integrity and mechanical isolation through the connector system
• Innovative signal beam interface, improves insertion loss compared to in-line signal beams
• Pushes interface resonance frequency past 30 GHz
• Small compliant pin (0.31mm ± -0.05) (Plated Through Hole Dimension 0.31mm)
• Cable assemblies with Temp-Flex Twinax Cables (28 or 30 AWG)
• Achieves data rates required by telecommunications and data center industries

Разъемы\Торцевые Разъемы и Разъемы Объединительных Плат

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