TE Connectivity's next generation MULTI-BEAM card edge connectors deliver the best overall power and signal density to address server market requirements for performance, profile and cost. MULTI-BEAM card edge connectors are also applicable in global data communication applications to decrease costs. These products are the next generation card edge connectors over the current SEC-II power card edge products and deliver superior current and signal density with a unique design. The scalable and modular features also support greater flexibility in configuration and PCB design.

• Highest signal density in the market with 60% signal space savings (signal pitch 1.00mm, power pitch 7.26mm)
• The series provide better gatherability for blind-mate applications: +/-2.0mm (X), +/-1.54mm (Y) and supports two PCB thickness: 1.57mm and 2.36mm
• Current Rating: Power contact: up to 43A, Signal contact: up to 2A
• Voltage Rating: Power: 100V max., Signal: 60V max.
• Mechanical shock and vibration resistant
• Low mating force: 6N max. per power contact, 1.5N max. per signal contact
• Durability: 200 mating cycles

Разъемы\Card Edge Connectors

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