Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is a highly conformable gel-like modulus.

• Eliminates air gaps to reduce thermal resistance
• Highly conformable to reduce interfacial resisitance
• Low-stress vibration dampening
• Compatible with automated dispensing equipment
• Supplied in a 100 x 100mm sheet

Системы Охлаждения и Управления Тепловыми Процессами\Материалы Теплового Взаимодействия\Теплопроводящий Материал

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