Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is ideal for applications where you need high thermal performance and high conformability from a non reinforced pad that is inherently tacky.

• Eliminates air gaps to reduce thermal resistance
• Highly conformable to reduce interfacial resisitance
• Low-stress vibration dampening
• Compatible with automated dispensing equipment
• Supplied in a 100 x 100mm sheet

Системы Охлаждения и Управления Тепловыми Процессами\Материалы Теплового Взаимодействия\Теплопроводящий Материал

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